Epoxide resin, halogen-free, - containing by weight more than 2 % phosphoros calculated on the solid content, chemically bound in the epoxide resin, - not containing any hydrolysable chloride or containing less than 300 ppm hydrolysable chloride, and - containing solvents for use in the manufacture of prepreg sheets or rolls of a kind used for the production of printed circuits — Products containing more than 35 % by weight of epoxy resins, also known as epoxide resins or polyepoxides, which are polymers or prepolymers containing reactive epoxy groups, based on epichlorohydrin (‘ECH’) and an aliphatic or aromatic alcoholic component (such as BPA), in solid, semi-solid or liquid forms, having all types of grade, purity, molecule weight or molecular structure, whether or not containing modifiers, curing agents, or additives, so long as the curing agents have not chemically reacted so as to cure the epoxy resin or convert it into a different product no longer containing epoxy groups