Gallium arsenide wafers, doped
957293 · 1995-02-01 — Carbon Doped Gallium Arsenide Wafers
This is in reference to your inquiry regarding the subject wafers on behalf of Marubeni America, Inc. FACTS: The subject merchandise consists of highly-resistive carbon- doped gallium arsenide (GaAs) wafers. The wafers are produced from compound crystal ingots grown by the Liquid Encapsulated Czochralski (LEC) method. The carbon doping concentration is controlled by degassing impurities present in the raw material (including contaminated carbon), and then introducing controlled carbon concentration through the addition of purified carbon monoxide gas (CO), as the crystal is pulled. The…
953265 · 1993-05-14 — Protest No. 3196-91-100019; Showa Denko America; GAP-EPI-R Type Unmounted Light Emitting Diode Chips; LED; Wafer; Chip; Chemical Element Doped For Use In Electronics; 3818.00.00; 8541.40.20; 8541.40.60
This is our response to Protest Number 3196-91-100019, dated September 27, 1991, and Application for Further Review, regarding the classification of "GAP-EPI-R Type Unmounted LED Chips," under the Harmonized Tariff Schedule of the United States (HTSUS). The subject merchandise was entered on February 21, 1991, and the entry was liquidated on August 16, 1991. The protest was timely filed on September 27, 1991. FACTS: The "GAP-EPI-R Type Unmounted LED Chips" ("wafers") are described as gallium phosphate wafers and dice that are imported in "material" form to be used exclusively in the…
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