For assembling semiconductor devices or electronic integrated circuits
Part of: 84864000 — Machines and apparatus specified in note 11(C) to this chapter
N342524 · 2024-09-23 — The tariff classification of dispensing machines from Taiwan
At issue are five series of robotic dispensing machines for surface mount technology (SMT) dispensing operations. The dispensing machines perform various bonding, sealing, and coating applications in connection with the assembly of semiconductors, LEDs, and electronics. They are principally used to apply epoxies, adhesives, solder paste, and other fluid materials in connection with semiconductor device and integrated circuit assembly or “packaging,” including dam and fill, LED encapsulation, Chip Scale Package (CSP), Chip on Board (COB) encapsulation, and ball grid array (BGA) for integrated…
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