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Part of: 85419000 — Parts
957189 · 1995-01-11 — Anti-reflection coated silicon wafer; 3818.00.00; EN 38.18; doped silicon wafer; solar panel; Article 509; NAFTA; T.D. 94-1; 19 CFR 181.92(b)(5) and (6)
This is in regards to your letter dated September 16, 1994, to Customs in New York, on behalf of Kyocera International, Inc., concerning the country or origin, applicability of the North American Free Trade Agreement (NAFTA) and tariff classification of solar panels under the Harmonized Tariff Schedule of the United States (HTSUS). A flow diagram of the production process was submitted for our examination. FACTS: Kyocera presently manufactures its solar panels in Japan. However, it is considering establishing a solar panel manufacturing plant in the U.S. For the proposed manufacturing…
955988 · 1994-03-07 — Modification of NY 893295; Heatsink/Heat Spreading Substrates and Submounts; Electrical Apparatus; Semiconductor Devices; Electronic Integrated Circuits; Section XVI, Note 2; 8536.30.00
This is in reference to NY 893295, dated January 20, 1994, which dealt with the classification of heatsink/heat spreading substrates and submounts under the Harmonized Tariff Schedule of the United States (HTSUS). NY 893295 was issued to you, on behalf of Sumitomo Electric U.S.A. Inc., in response to a letter from your office dated December 17, 1993, to the Area Director of Customs, New York Seaport. FACTS: The merchandise consists of heatsink/heat spreading substrates and submounts used in electronic integrated circuits and semiconductor devices, such as microwave diodes, laser and light…
955949 · 1994-03-07 — Revocation of NY 893289; Heatsink/Heat Spreading Submounts; Electrical Apparatus; Semiconductor devices; Section XVI, Note 2; 8536.30.00
S.A. Inc., requesting reconsideration of NY 893289, dated January 14, 1994, which dealt with the classification of heatsink/heat spreading submounts under the Harmonized Tariff Schedule of the United States (HTSUS). FACTS: The merchandise consists of heatsink/heat spreading submounts used in semiconductor devices, such as microwave diodes, laser and light emitting diodes, high frequency transistors, and thyristors. The submounts are made to customer specifications from a combination of copper-tungsten, copper-molybdenum, aluminum- silicon, aluminum nitride ceramics, translucent cubic boron…
950868 · 1992-12-31 — Semiconductor Parts; Copper Bases; Section XVI, Note 2(b)
FACTS: The merchandise consists of semiconductor bases made of copper. The purpose of the base is to mount the semiconductor device, consisting of the semiconductor and the base itself, into a heat sink. You claim that the copper base is an integral part of the semiconductor. The semiconductor device generates heat which is absorbed by a separate heat sink. ISSUE: What is the proper classification of the subject semiconductor base under the HTSUS? LAW AND ANALYSIS: Classification of merchandise under the HTSUS is in accordance with the General Rules of Interpretation (GRI's), taken in order.…
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