Other instruments and apparatus: — For measuring or checking semiconductor wafers or devices (including integrated circuits)
N349303 · 2025-05-30 — The tariff classification of integrated circuit sockets from Japan
Descriptive literature was provided for our review. The items under consideration are described as integrated circuit (IC) sockets, which are devices used for testing semiconductor chips during the semiconductor manufacturing processes. These sockets are mounted onto a burn-in board (BIB), or test board, during quality control and reliability assessments. The BIB is connected to a pattern generator and power supply in the burn-in chamber. The chamber that surrounds the burn-in board provides an environment for testing the chips under a range of temperatures (from -60°C to 150°C). The sockets…
N337433 · 2024-01-17 — The tariff classification of semiconductor test equipment from Italy
S.A. LLC, you requested a tariff classification ruling. The first item under consideration is described as the ETNA System, which is test equipment specifically designed for qualification and burn-in trials on a wide range of semiconductor devices. The system is based on three main platforms. The first is the test platform, which includes the electronics needed to stimulate and monitor the devices under test (DUTs). The second is the thermal platform, which includes the climatic chambers to perform the trials at different temperatures. The third is the software platform, which includes the…
N325730 · 2022-05-06 — The tariff classification of an Integrated Development Platform from China.
The item under consideration is described as an Integrated Development Platform (IDP), which is a device assembly that is used for facilitating integrated circuit (IC or chipset) verification, software development, system level testing, chip circuitry testing, and power measurement. IDPs comprise of multiple circuit card assemblies, or populated printed circuit board assemblies, assembled together in a specially designed, stacked configuration centered around an IC test socket. The test socket is assembled onto the main board of the IDP with additional test ports integrated on both the main…
N325411 · 2022-04-18 — The tariff classification of a Core Development Platform (CDP) from Taiwan
The item under consideration is described as a Core Development Platform (CDP), which is a device assembly that is used for facilitating integrated circuit (IC or chipset) verification, software development, system level testing, chip circuitry testing, and power measurement. CDPs comprise of multiple circuit card assemblies, or populated printed circuit board assemblies, assembled together in a specially designed configuration centered around an IC test socket. The test socket is assembled onto the main board of the CDP with additional test ports integrated on both the main and secondary…
N280220 · 2016-11-09 — The tariff classification of dynamic test handlers from Japan
The merchadise at issue consists of three models of dynamic test handlers, identified by the model numbers M6242, M4841, and M4742. The dynamic test handlers are machines used in the testing of packaged integrated circuit devices. The handlers perform no measuring or checking function themselves, but are designed to be docked to a separate, standalone semiconductor test system. The handlers pick up trays of packaged integrated circuit devices and physically place the devices in the test system’s sockets. The handler holds the devices in the sockets while the test system checks the…
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