Other: — Printed circuit assemblies: — Of instruments and apparatus of subheading 9030.40 or 9030.82
Part of: 903090 — Parts and accessories:
H268513 · 2016-02-23 — Tariff classification of a wafer probe card, probe interface board (PIB), and load board
S. Customs and Border Protection (CBP), on behalf of Qualcomm, Inc. (“Qualcomm”), seeking a prospective ruling on the tariff classification of a wafer probe card, probe interface board (“PIB”), and load board under the Harmonized Tariff Schedule of the United States (HTSUS). For the reasons set forth below, CBP concludes that the wafer probe card, PIB, and load board are classifiable under heading 9030, HTSUS, specifically in subheading 9030.90.66, as “parts and accessories” of instruments and apparatus of subheading 9030.40 or 9030.82. FACTS: The merchandise at issue consists of a wafer…
N170660 · 2011-07-06 — The tariff classification of Printed Circuit Assemblies from Thailand
, you requested a tariff classification ruling. No samples were provided. The merchandise at issue consists of four printed circuit assemblies (PCAs) designed for use in Spirent Test Center (STC) equipment. Regarding the STC, you state: “[The] STC allows users to test various types of telecommunications networks to understand how the network will perform, operate and, potentially, fail under various simulated conditions. Depending on the configuration purchased, STC can be applied to test the performance and response of traditional computer networks, as well as networks leveraging…
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