Other millstones, grindstones, grinding wheels and the like: — Of agglomerated synthetic or natural diamond
H277235 · 2018-11-30 — Revocation of NY 876359; Tariff classification of diamond wire from Italy
S. Customs and Border Protection (“CBP”), concerning the classification under the Harmonized Tariff Schedule of the United States (“HTSUS”), of diamond wire. Specifically, in New York Ruling Letter (“NY”) 876359, dated July 27, 1992, CBP classified diamond wire in subheading 8202.99.00, HTSUS. We have reviewed NY 876359 and found it to be in error. For the reasons set forth below, we are revoking NY 876359. Pursuant to 19 U.S.C. § 1625(c)(1), a notice was published in the Customs Bulletin, Volume 52, No. 39 on September 26, 2018, proposing to revoke NY 876359, and any treatment accorded to…
H284143 · 2017-12-28 — Request for classification of diamond circular saw blades
(“Husqvarna”), for a binding ruling as to the classification of diamond circular saw blades under the Harmonized Tariff Schedule of the United States (“HTSUS”). Your request was received by the National Commodity Specialist Division of U.S. Customs and Border Protection (“CBP”) and was forwarded to our office for review. We apologize for the delay in responding. Our decision as to the proper classification of the subject merchandise under the HTSUS is set forth below. Descriptions of the subject merchandise are based on descriptions of the same included in your ruling request and upon our…
H052562 · 2010-12-10 — Application for Further Review of Protest No. 3195-09-100019; Classification of a CMP pad conditioner
The following is our decision regarding the Application for Further Review (AFR) of Protest No. 3195-09-100019, filed on January 14, 2009, on behalf of VIAS International (protestant or Vias), against U.S. Customs and Border Protection’s (CBP) reclassification and subsequent liquidation of an entry of a certain CMP pad conditioner. FACTS: Chemical-mechanical planarization (CMP) is one step in the process of manufacturing semiconductor chips in which the surface of a silicon wafer is polished or flattened through the use of a CMP tool. The CMP tool features a rotating platen covered with CMP…
H085978 · 2010-11-19 — Application for Further Review of Protest No. 3195-09-100342; Classification of a diamond dresser conditioning disk
The following is our decision regarding the Application for Further Review (“AFR”) of Protest No. 3195-09-100342, timely filed on September 9, 2009, on behalf of Micron Technology, Inc. (“Micron”). The AFR concerns the classification of a diamond dresser conditioning disk under the Harmonized Tariff Schedule of the United States (“HTSUS”). FACTS: The subject merchandise consists of a diamond dresser conditioning disk used in the chemical mechanical planarization (“CMP”) process. CMP, also called chemical mechanical polishing, is a process used in semiconductor chip fabrication. Most…
952587 · 1993-01-26 — Crushed Diamond and Cobalt Segments, Saw Blade Cutting Parts, Crescent Shapes, Square Shapes; Amborite; Sawing Wire Beads; Natural or Artificial Abrasive Powder or Grain, Heading 6805; Abrasive Materials on a Backing; PRDs 1604-92-100001 and 1604-92-100002
This is our decision on Application for Further Review of Protests 1604-92-100001 and 1604-92-100002 dated, respectively, March 5, and June 11, 1992, filed by counsel on behalf of Diamant Boart America, against your action in liquidating multiple entries of certain saw blade segments, cutting tool heads and beads for cutting wire, from Belgium. Additional arguments made at a meeting in our office on December 2, 1992, were confirmed by counsel in a letter dated December 23, 1992. FACTS: There are three (3) types of articles in issue here: saw blade segments, the working parts of metal cutting…
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