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N342165 · 2024-09-12 — The tariff classification of dicing blades from China.
The merchandise under consideration is referred to as dicing blades, item numbers S1635-Q500-COL Blade, Q1025-Q500-COL Hub Blade, J1535-K200-ATK Semitec Nova Dicing Blades, S1235-Q5SH-ATK Semitec Standard Dicing Blade, and F1435 Standard Dicing Blade. From the information you provided, all five dicing blades measure 55.6 millimeters in diameter by 4.6 millimeters in thickness at their widest points, and consist of diamond agglomerated with nickel which has been affixed to a continuous rim aluminum alloy plate. The blades are used in semiconductor dicer machines to cut semiconductor wafers or…
N317657 · 2021-03-03 — The tariff classification of abrasive sanding plates from China.
The merchandise under consideration is four styles of abrasive sanding plates, referred to as the D-Maxx Palm, Orbital, Multitool, and Corner. Samples were submitted with your ruling request and will be returned to you. The D-Maxx Palm is square in shape and measures approximately 11 centimeters wide by 11 centimeters long by .3 centimeters thick at its widest points. The D-Maxx Orbital is disc-shaped and measures approximately 12.5 centimeters in diameter by .3 centimeters thick at its widest points The D-Maxx Multitool is triangular in shape and measures approximately 7 centimeters wide by…
H284143 · 2017-12-28 — Request for classification of diamond circular saw blades
(“Husqvarna”), for a binding ruling as to the classification of diamond circular saw blades under the Harmonized Tariff Schedule of the United States (“HTSUS”). Your request was received by the National Commodity Specialist Division of U.S. Customs and Border Protection (“CBP”) and was forwarded to our office for review. We apologize for the delay in responding. Our decision as to the proper classification of the subject merchandise under the HTSUS is set forth below. Descriptions of the subject merchandise are based on descriptions of the same included in your ruling request and upon our…
H052562 · 2010-12-10 — Application for Further Review of Protest No. 3195-09-100019; Classification of a CMP pad conditioner
The following is our decision regarding the Application for Further Review (AFR) of Protest No. 3195-09-100019, filed on January 14, 2009, on behalf of VIAS International (protestant or Vias), against U.S. Customs and Border Protection’s (CBP) reclassification and subsequent liquidation of an entry of a certain CMP pad conditioner. FACTS: Chemical-mechanical planarization (CMP) is one step in the process of manufacturing semiconductor chips in which the surface of a silicon wafer is polished or flattened through the use of a CMP tool. The CMP tool features a rotating platen covered with CMP…
H085978 · 2010-11-19 — Application for Further Review of Protest No. 3195-09-100342; Classification of a diamond dresser conditioning disk
The following is our decision regarding the Application for Further Review (“AFR”) of Protest No. 3195-09-100342, timely filed on September 9, 2009, on behalf of Micron Technology, Inc. (“Micron”). The AFR concerns the classification of a diamond dresser conditioning disk under the Harmonized Tariff Schedule of the United States (“HTSUS”). FACTS: The subject merchandise consists of a diamond dresser conditioning disk used in the chemical mechanical planarization (“CMP”) process. CMP, also called chemical mechanical polishing, is a process used in semiconductor chip fabrication. Most…
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