Parts
Part of: 8542 — Electronic integrated circuits; parts thereof:
N325811 · 2022-05-13 — The tariff classification of printed circuit substrates from South Korea
The items concerned are referred to as the FCCSP (Flip Chip Chip Scale Package) and the FCBGA (Flip Chip Ball Grid Array). The FCCSP (Flip Chip Chip Scale Package) is a substrate used in the manufacture of application processors. It is a connection path for electrical signals between the IC and the main board (PCB). It is a structure that converts the fine wiring of the IC into the range of the main PCB. The substrate is made of an insulating material with excellent cooper adhesion to realize fine circuit line width. A printing process is used to create the circuit element and pathways. There…
K87151 · 2004-06-30 — The tariff classification of an Aluminum Nitride Plain Substrate, Aluminum Nitride Copper Coated Substrate, Silicon Nitride Plain Substrate, and Silicon Nitride Copper Coated Substrate from Japan
The merchandise is described in your letter as an Aluminum Nitride Plain Substrate, an Aluminum Nitride Copper Coated Substrate, a Silicon Nitride Plain Substrate, and a Silicon Nitride Copper Coated Substrate. Samples of each of these items were submitted to this office for classification purposes. These high thermal conductivity heat sink and heat spreading Aluminum Nitride and Silicon Nitride substrates were conceived, designed and developed specifically for use as the platforms upon which high power semiconductor components and circuits could be safely, reliably and economically mounted…
f87608 · 2000-06-13 — The tariff classification of a Heat Conductive Sheet from Japan
The merchandise is described in your letter as a heat conductive sheet. The sheet is a self-adhesive article of boron nitride and silicone rubber, which is affixed to the top of the CPU microprocessor chip on a notebook computer motherboard. It is composed of a silicone rubber base and a top layer of silicone rubber combined with cubic boron nitride. The boron nitride acts as a heat conductor to draw the heat away from the CPU chip on the motherboard. On the bottom is a layer of adhesive covered by a sheet of PET film. The PET film is peeled away during application and discarded. The heat…
D88010 · 1999-03-10 — The tariff classification of a blank ceramic substrate, an inductor filter core, a dielectric puck, a ceramic substrate with lines, and a ceramic substrate with holes from Japan
The merchandise is described in your letter and attached information as a blank ceramic substrate, an inductor filter core, a dielectric puck, a ceramic substrate with lines, and a ceramic substrate with holes. Samples were also submitted. The blank ceramic substrate is composed of 99% Alumina (porcelain). It is .035" thick, 4.25" wide, and 3.6" long. There are no holes or lines in the substrate that would dedicate it to a particular use. This type of blank substrate is sold to Laser Houses who will cut them into various sizes for different hybrid IC manufacturers based on order…
a88295 · 1996-10-29 — The tariff classification of lead frames for integrated circuits (ICs) from Germany
Paul, Minnesota. The merchandise is described in a letter from Mr. Al Miller of Buckbee-Mears Company as lead frames. A sample was also submitted. The lead frames have been photo-chemically etched on a copper sheet. The submitted sample is a copper sheet containing thirty six lead frames designed for IC packaging. The copper sheet has six strips of six parts each. In its imported condition the electrical leads have been formed on each device. After importation the strips will be cut from the sheets and plated in the United States. These strips of parts are sold to U.S. customers, and are used…
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