Machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits
N361145 · 2026-05-14 — The tariff classification of an automatic dicing saw from Japan
The product in question is an automatic dicing saw, model DAD3430, specifically engineered and principallyused for the semiconductor industry. The machine utilizes a high-speed spindle equipped with a circulardiamond blade to singulate individual integrated circuits (die) from a processed silicon wafer. The singulationprocess involves securing the wafer on a vacuum chuck, automatically aligning the cutting path to a precisionof 0.001 mm, and performing a “full-cut” through the wafer using a diamond blade rotating at speeds up to60,000 rpm. The DAD3430 is specialized for extra-high precision…
N361144 · 2026-05-14 — The tariff classification of an automatic dicing saw from Japan
The product in question is an automatic dicing saw, model DAD3231, specifically engineered and principallyused for the semiconductor industry. The machine utilizes a high-speed spindle equipped with a circulardiamond blade to singulate individual integrated circuits (die) from a processed silicon wafer. The singulationprocess involves securing the wafer on a vacuum chuck, automatically aligning the cutting path to a precisionof 0.001 mm, and performing a “full-cut” through the wafer using a diamond blade rotating at speeds up to60,000 rpm. The DAD3231 emphasizes high performance and…
N349446 · 2025-06-13 — The tariff classification of an electron beam lithography tool from Germany
The Raith 150 Two is a high-resolution low voltage electron beam lithography tool for direct e-beam writing (drawing) of circuit patterns on semiconductor wafers and other resist-coated semiconductor materials. It is suitable for writing on six-inch photomasks and wafers with a handling capability of 7-inch masks and 8-inch wafers. The Raith 150 Two is also equipped with an ultra-high resolution optics system. The Scanning Electron Microscopy (SEM) function provides images of the sample surface to assist in navigating specific areas for e-beam patterning. The applicable subheading for the…
N349449 · 2025-06-13 — The tariff classification of the e-LINE Plus 100 electron beam lithography and metrology system from Germany
The Raith e-LINE Plus 100 is an ultra-high-resolution direct write electron-beam (E-beam) lithography and metrology tool designed for high resolution direct write circuit patterning of semiconductor wafer and other resist coated semiconductor materials. It has a 4-inch wafer capability. The e-LINE Plus 100 is also capable of performing nanofabrication applications such as Electron Beam-Induced Deposition (EBID) and etching for direct writing with nanometer resolution. The tool includes scanning-electron-based imaging and metrology for process control. The applicable subheading for the Raith…
N349451 · 2025-06-13 — The tariff classification of a hybrid EBL-SEM electron beam lithography system from Germany
The Pioneer Two is a compact electron beam lithography (EBL) system designed for high resolution patterning of semiconductor wafer materials. This direct electron-beam write-on apparatus is designed to write (draw) circuit patterns onto wafers coated with sensitized semiconductor materials. As a hybrid EBL-SEM (scanning electron microscope) system for these semiconductor nanostructures, the Pioneer Two is capable of fabrication (lithography), as well as imaging (electron microscopy), and metrology (measurements using laser interferometer stage) for previously written nanostructures. No…
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