Parts and accessories
N361571 · 2026-05-29 — The tariff classification of a dynamic gas lock membrane device from the Netherlands
The product in question is a dynamic gas lock membrane device (DGLM), designed solely for use withinASML’s extreme ultraviolet (EUV) semiconductor lithography system. The DGLM is installed within thewafer stage region as a specialized membrane assembly positioned directly above the semiconductor waferduring lithographic processing. EUV light reflects off the lithography machine’s reticle, then six mirrors, andthen passes through the DGLM membrane before exposing the semiconductor pattern on the wafer.You state that the primary function of the DGLM is to act as a physical barrier to prevent…
N359267 · 2026-03-13 — The tariff classification of a lens manipulator module from Germany
The product in question is the FlexWave Module, model FLEXWAVE MK2 19XYI (Module). Also referred to as a lens manipulator, the Module will be imported as a replacement/upgrade for installation in an ASML NXT model series deep ultraviolet (DUV) semiconductor photolithography system (scanner). The Module will be contained in the projection lens apparatus of the scanner that transfers the image of semiconductor patterns from the reticle (aka the mask or photomask) to the silicon wafer. The Module’s function is to improve image quality by correcting and mitigating aberrations on the wavefront of…
N358520 · 2026-02-12 — The tariff classification of a pre-installation kit from the Netherlands
The product in question is a Pre-Install Kit, part number 3800E PRE-INS-SETS, designed specifically for ASML’s NXE 3800E EUV (extreme ultraviolet) semiconductor photolithography system (EUV). The main components of the EUV, not imported with the Pre-Install Kit, are comprised of large modular assemblies, including the wafer stage, wafer handler, reticle stage, reticle handler, and light source, housed in a “Main Cabinet” located in the clean room of a semiconductor manufacturing plant (or “fab”), plus a number of cabinets, machines, and equipment in the sub-fab, i.e., the floor below the…
N350440 · 2025-07-10 — The tariff classification of an EUV lithography system drive laser module from Germany
At issue are various units and equipment for ASML’s NXE 3800E EUV (Extreme Ultraviolet) semiconductor lithography system, which you state will be imported together and constitute the lithography system’s Drive Laser Module. These attached or interconnected units and equipment consist of: radio-frequency (RF) power amplifiers; seed laser module; beam transport system periscope; power distribution system; control cabinet (electric); gas supply system; and cooling system. Also included in the shipment will be certain pre-install items, namely electrical and data cables, hoses for gas supply and…
N349761 · 2025-06-23 — The tariff classification of a wafer polishing mounting jig from Japan
The product in question is a mounting jig, Model TZ07VL(454-150.3-5)280-PEI. The mounting jig is a flat, round, 1.35mm thick article with a 454mm outer diameter, and is used in Chemical Mechanical Polishing (CMP) machines suitable only for semiconductor wafer polishing applications. The mounting jig can hold up to five silicon carbide (SiC) semiconductor wafers. The mounting jig is comprised of four layers: a frame layer of polyetherimide resin, a surface layer of polyethylene foam, a bonding layer of rubber adhesive and polyethylene terephthalate film (film), and an adhesive layer of acrylic…
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